Team Group Team Group XTREEM FFXD532G7600HC36FDC01 memory module 32 GB 2 x 16 GB DDR5 ECC | Maggioro
Team Group XTREEM FFXD532G7600HC36FDC01 memory module 32 GB 2 x 16 GB DDR5 ECC

Team Group

Team Group XTREEM FFXD532G7600HC36FDC01 memory module 32 GB 2 x 16 GB DDR5 ECC

£457.99
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Product Description

  • Honorable T-FORCE Logo exceeds overclocking limits.
  • Meticulously layered high-quality aluminum sandblasted fin for exceptional heat dissipation.
  • Sturdy 2mm heat spreader for perfect heat dissipation improvement.
  • High-quality IC with the patented technique.
  • Power management chip for stable and effective power usage.
  • On-Die ECC for a more stable system.
  • Honorable T-FORCE Logo exceeds overclocking limits.
  • With T-FORCE LAB’s superb R&D capability, the brand-new T-FORCE XTREEM DDR5 exceeds the frequency limit of DDR5 memory.
  • The product has T-FORCE logo symbolizing our utmost pride, showcasing its exceptional existence, it is definitely the best choice in the world of overclocking products..
  • Meticulously layered high-quality aluminum sandblasted fins for exceptional heat dissipation.
  • Inspired by the image of energy conversion between the hot and cold under high temperatures from a volcano, the exterior and looks of T-FORCE XTREEM DDR5 has meticulously layered high-quality aluminum sandblasted fins resembling the texture of basalt and the beach, delivering exceptional heat dissipation capabilities.
  • The surface is etched with T-FORCE logo to certify its excellence..
  • Sturdy 2mm heat sink for perfect heat dissipation improvement.
  • T-FORCE XTREEM DDR5 adopts 2mm aluminum alloy heat spreader to increase its quality and heat capacity.
  • The product also has thermal gap pad with high thermal conductivity to strengthen PMIC heat dissipation effects, coupled with anti-acid, alkaline, rust and inconducive anodic treatment on the surface to deliver perfect heat dissipation performance overall..
  • High-quality IC with patented technique.
  • Uses our proprietary IC grading testing validation technique—GRADING METHOD FOR MEMORY (Invention patent number in Taiwan: I751093; Invention patent number in USA: US11488679B1) to develop DDR5 high-performance memory module successfully..
  • Power management chip for stable and effective power usage.
  • Power management chip minimizes noise interference, stabilizes power and distributes power to each electronic component effectively, supplying power to the system with stability and fastness..
  • On-Die ECC for a more stable system.
  • Supported with On-die ECC providing error correction and detection, the mechanism stabilizes the system while pursing performance..
  • .
  • Cooling type.
  • Heatsink.
  • Memory voltage. 1.4 V.
  • CAS latency. 36.
  • On-Die ECC.
  • Yes.
  • ECC.
  • Yes.
  • Memory form factor. 288-pin DIMM.
  • Component for.
  • PC.
  • Memory clock speed. 7600 MHz.
  • Internal memory type.
  • DDR5.
  • Memory layout (modules x size). 2 x 16 GB.
  • Internal memory. 32 GB.
  • Buffered memory type.
  • Registered (buffered).
  • General.
  • Product family.
  • XTREEM.
  • Weight & dimensions.
  • Height. 48.8 mm.
  • Depth. 134.5 mm.
  • Width. 8.2 mm.
  • Packaging data.
  • Package type.
  • Box

Specifications

Delivery Time 3-5 working days
Delivery Cost £0.00

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